Micross – Harvesting Boards’ Components

Obsolete, long lead time, and high cost components can be safely removed from PCB’s using hot gas rework in accordance with IPC-7711/7721, refinished by Micross’ RHSD process, inspected, tested, and repackaged to meet all original component manufacturers’ mechanical and electrical specifications.

  • Component Recovery & Re-use
  • Robotic Hot Solder Dip or Exchange
  • Leaded components realigned
  • BGA & QFP Harvesting
  • BGA Re-balling & Ball Attach: Pb-free to SnPb  and reverse
  • Testing