Micross – Harvesting Boards’ Components

Obsolete, long lead time, and high cost components can be safely removed from PCB’s using hot gas rework in accordance with IPC-7711/7721, refinished by Micross’ RHSD process, inspected, tested, and repackaged to meet all original component manufacturers’ mechanical and electrical specifications.

• Component Recovery & Re-use
• Robotic Hot Solder Dip or Exchange
• Leaded components realigned
• BGA & QFP Harvesting
• BGA Re-balling & Ball Attach: Pb-free to SnPb  and reverse
• Testing