Micross – Component Modification Services for New Space applications (05/2024)

Robotic Hot Solder Dip – compliance with RoHS directive

Solutions provided:

• Tin Whisker Elimination. US Navy qualified process removes 100% of the pure tin and replaces it with SnPb (tin-lead) to prevent tin whiskers. Parts can be processed per GEIA-STD-0006.
• Lead-Free Solder Joint Weakness Prevention. Prevents weak solder joints by removing all of the lead-free finish and replacing it with tin-lead.
• Refinishing with Tin/Lead, Lead-free, and Custom Solder Alloys The flexibility of the equipment and parameters allow for refinishing to a wide variety of alloys to satisfy typical to exotic requirements.
• Restoration of Solderability. Corrects finishes affected by poor quality plating, oxidation, foreign material, or after removal from printed circuit assemblies.
• Gold Removal per J-STD-001. Removes gold in the effective seating plane and replaces it with SnPb.
• RoHS Compliance. Removes the lead-bearing alloy and replaces it with SAC305 (tin-silver-copper) or any other specified alloy.

Micross can also provide in-house solderability testing and X-ray Fluorescence (XRF) scanning services to identify component-finish types.