Thermexit – Thermal Interface Material Gap Filler Pads (11/2021)

Thermexit-HP-40
High Performance
TIM Pad

Key Features:

  • Non-silicone, non-reactive, no-cure system
    (no resin-filler separation or unconsumed reactant outgassing)
  • High thermal stability, with continuous operation over 150°C
  • High thermal conductivity (>40W/mK)
  • Easy pick and place application (naturally sticky) without residue/mess
  • Highly compressible to minimize contact resistance without high force and component stress

 

Thermexit-EI-20
Electrically Insulating
TIM Pad

Key Features:

  • Non-silicone, non-reactive, no-cure system
    (no resin-filler separation or unconsumed reactant outgassing)
  • High thermal stability, with continuous operation over 150°C
  • High thermal conductivity (>15W/mK)
  • Easy pick and place application (naturally sticky) without residue/mess
  • Highly compressible to minimize contact resistance without high force and component stress
  • High breakdown voltage

 

Market applications:

  • Consumer electronics
  • Power supplies
  • Automotive electronics
  • LED, LCD and optical display
  • Motor controls
  • High power density semiconductors
  • Batteries or energy storage devices