corfin-logos-solutions-no-italic-light-greenCorfin Industries prevents catastrophic failure in mission and life critical systems by eliminating the risks of tin whiskers and gold embrittlement. They provide component preparation services to the defense, aerospace, medical, telecommunications, transportation, industrial, and other high reliability industries. Corfin pioneered their core technology, Robotic Hot Solder Dip, in the 1980′s and today serve major OEMs and their subcontractors around the world.

A good deal of their services are typically offered as Obsolescence solutions which constitute a particularly challenging field of requirements. Their possibilities concerning Obsolescence solutions are as follows:

  • The Robotic Hot Solder Dip (RHSD) will be of use both when the current parts are not available in the required finish but also to refresh the finish on parts that have been stored badly or subjected to other instances whereby the finish is no longer viable
  • The lead reconditioning service repairs damaged parts
  • Lead attach changes the parts from SMT to a leaded device
  • Component harvesting enables you to recover valuable parts from boards and rework them
  • BGA re-ball

Corfin Industries has earned an unmatched reputation for quality and dependability resulting in preferred status for numerous top tier global companies.

Latest Product Catalogs: Corfin Industrie Standards, BGA Reballing, Tin Whisker Brochure, Lead Attach

Obsolescence Presentation: Obsolescence Presentation

Warranty: 1 year

Certifications:  ISO 9001 and AS9100 registered

Fields of application: Aerospace, Defence, Implantable Medical, Space and Transportation

Products: Component preparation services

 For more information: