Corfin – Component Obsolescence Challenges Solved

corfin-logos-solutions-no-italic-light-greenCorfin solves component obsolescence challenges with Robotic Hot Solder Dip in compliance with RoHS directive. In addition, Corfin offers the following services for Obsolescence issues:

  • Non-availability of Tin Lead components (RHSD)
  • Aged devices with poor solderability (RHSD)
  • Life-time buy opportunity (Long Term Packaging)
  • High value devices (Harvesting, Reconditioning)
  • CCA redesign (Harvesting)
  • Non-availability of devices with Terminations other than No Leads (Lead Attach)